Our technologies for semiconductor materials and packaging meet and exceed the ever-changing demands of the semiconductor industry.
Wafer Fabrication
Our ViaForm Copper Damascene processes deliver superior filling performance for wafer fabrication. Each process is specially designed for manufacturing advanced copper interconnects and provides a high degree of process control that enables a more robust interconnect fill capability and ensures greater device reliability.
Read MoreWafer Level Packaging
Our wafer bump processes are specially formulated for emerging technologies, such as 3-D packaging. Our processes include copper pillar/post, copper RDL, nickel, tin-silver bump, gold bump, and through-silicon via (TSV). All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety concerns.
Read MoreIN THE NEWS
MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan Sep 3, 2020, 9:42 AM
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Product Release: MacuSpec THF 100 Mar 31, 2020, 1:45 PM
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MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference Feb 14, 2020, 4:13 PM
Read MoreINDUSTRIES SERVED
Automotive
MacDermid Enthone’s Marketing and OEM teams work very closely with the worldwide leaders in Automotive Electronics and Instrumentation to provide consistent and reliably effective…
Printed Electronics
Companies that are in, or beginning to explore entry into the $10+ billion printed electronics market can look to MacDermid Alpha Electronics Solutions for across-the-board support.
Telecommunications
The communications market has seen significant changes over the last decade. This market is growing rapidly and incorporating more technical changes than any other market.…
