Maintaining The Patented Pretreatment System

Electroless copper has been the manufacturing standard for over 30 years, and we have been there since the beginning. Early innovations led to the development of the M-Systems/M-85, our highly successful heavy deposition electroless copper process. For the past 20 years, this process has become the industry standard for void free coverage. Maintaining the patented pretreatment system, We have developed the M-Copper Omega process, which takes copper to copper adhesion to a new level.


M-System integrated Desmear – Electroless Copper combines a statistically developed and proven primary metallization system to fit the needs of the Printed Circuit Board industry.  The first stage of the process is a chemical Desmear process designed for today’s variety of special resin systems.  The process can be tailored to run in vertical or horizontal equipment for everything from high performance multilayer boards to flexible circuit applications.

The second stage is our offering of advanced electroless copper processes with options from low build to high build thicknesses.  The core of the process is our M-Condition line of conditioners selected for the best match to the material types being run including FR-4 epoxies, polyimide, flex or high frequency, low loss materials and our patented M-Activate system that provide superior coverage on glass and resin surfaces while minimizing the palladium coverage on copper foil.  Together with our patented M-Accelerate system, we can offer superior back light coverage and strong interconnects that consistently survive the stresses of thermal expansion and movement in reflow and assembly.  M-Copper processes can be chosen for the specific thickness range desired given the dwell time and whether processing is vertical or horizontal. 


M-Copper Omega

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The M-Copper Omega metallization process combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional conditioning and acceleration steps to enhance glass coverage. This enhanced coverage yields superior post pattern plate backlight performance. The statistically designed electroless copper bath, when used with enhanced solution transport will produce the highest yields on high aspect ratio holes and blind microvias.

The increased functionality of the newest resins systems present another set of challenges. Although the higher temperature resins meet designer specifications, they tend to be more chemically inert and more difficult to process. To meet these new processability and reliability benchmarks, we have developed a system to overcome these obstacles.

M-Copper 15

MacDermid Enthone M-Copper 15 is the thin deposition electroless copper developed specifically for fabricators that require process flexibility and reduced overall chemical costs in the development of their super thick circuit boards.

M-Copper 15, able to plate 15 microinches in 15 minutes, is impervious to bath loading and can be utilized in either basket mode or 1-up in-line for ultimate flexibility. With a load factor of 0.20 – 1.75 square feet per gallon, the reduced amount of chemicals used in the plating bath enables each shipment to last longer. Highly reliable, M-Copper 15 is engineered for low deposit stress, resulting in superior hole wall adhesion. It also features lower hydrogen evolution,which delivers a more uniform electroless copper deposition in the center of high aspect ratio holes. Using the same activation sequence as our renowned.

M-Copper 15 is the right choice for all of your highest technology circuit board projects.



MultiFlex is formaldehyde and cyanide-free electroless copper process. It provides the ultimate through-hole reliability and material compatibility superior coverage and adhesion with minimal waste.

MultiFlex Key Features

  • Compatible with all alkaline-sensitive materials
  • Direct copper-to-copper bonding improves reliability
  • No formaldehyde
  • Engineered for reliabilty and performance
  • Plates only non-conductive surfaces
  • Maximizes cost efficiency

Via Dep 4550


Standard electroless copper blisters when plated on smooth, low adhesion substrate materials. With super adhesion and low plated stress, Via Dep 4550 stays intact without blistering.

MacDermid Enthone Via Dep 4550 electroless copper system is the industries choice primary metallization for difficult-to-plate substrates. The 4550 process offers superior adhesion on inert surfaces and difficult structural designs while maintaining structural integrity.  The zero stress, blister free deposit for SAP, MSAP and Flex applications assures that your metallization needs on complicated hybrid devices can be met with ease.

7 Mil Via on AP Material – Conventional Electroless Copper
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7 Mil Via on AP Material – Via Dep 4550

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Product Benefits:

·      Stress free copper deposit

·      Environmentally friendly tartrate based plating solution

·      Low operating temperature for reduced operating costs

·      Compatibility with flex, rigid-flex, and rigid PCB designs

·      Drop-in replacement to existing electroless copper line

·      Passes IPC-TM-650 for thermal stress on plated through holes