M-Copper EF

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MacDermid Enthone M-Copper EF is the only electroless copper system on the market that is sold by an international plating supplier which can outperform local suppliers at a competitive price. M-Copper EF is specifically formulated from decades of experience with electroless copper plating and modern innovations to allow for a revolution in quality and service in a segment of the PCB industry that rarely sees new offerings. Your OEM customers will feel more confident knowing that their products were assembled with a process backed by a world-class organization. With M Copper EF you can rest assured that you are using only the best electroless copper metallization available. Don’t fall into the trap of compromising quality for cost, with M-Copper EF, you can have it all.

MacuDep HDI

MacDermid Enthone MacuDep HDI is a horizontal electroless process that provides unmatched uniformity on even the most critical, high reliability materials and complex structures. Utilizing a patented colloidal activation sequence, it enables catalytic activity without expensive reduction steps. And most of all, MacuDep HDI enables users to confidently master the art of handling more complicated board designs to achieve greater profitability.

Via Dep 4550


Standard electroless copper blisters when plated on smooth, low adhesion substrate materials. With super adhesion and low plated stress, Via Dep 4550 stays intact without blistering.

MacDermid Enthone Via Dep 4550 electroless copper system is the industries choice primary metallization for difficult-to-plate substrates. The 4550 process offers superior adhesion on inert surfaces and difficult structural designs while maintaining structural integrity.  The zero stress, blister free deposit for SAP, MSAP and Flex applications assures that your metallization needs on complicated hybrid devices can be met with ease.

7 Mil Via on AP Material – Conventional Electroless Copper
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7 Mil Via on AP Material – Via Dep 4550

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Product Benefits:

·      Stress free copper deposit

·      Environmentally friendly tartrate based plating solution

·      Low operating temperature for reduced operating costs

·      Compatibility with flex, rigid-flex, and rigid PCB designs

·      Drop-in replacement to existing electroless copper line

·      Passes IPC-TM-650 for thermal stress on plated through holes