An Industry Leader in Metallization

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The technical challenges of today’s electronics such as miniaturization, increased signal speeds, and advanced resin systems are combined with ever growing reliability requirements. To meet these needs, all processes involved need to run at the highest level of quality. The foundation of all of this starts with primary metallization. 

Our broad portfolio of electroless coppers and direct metallization solutions allow fabricators to initiate plating on nearly any board material with excellent circuit uniformity. Through continued innovation, we are developing new solutions to meet the ever-changing electronics manufacturing landscape. Our combination of technology and applications experience has enabled us to become known worldwide as an industry leader in primary metallization systems for all types of circuit boards. 

Direct Metallization

Electronics manufacturers have chosen Direct Metallization systems over electroless copper processes due to lower cost of ownership and easier-to-maintain equipment. Today, over 600 Direct Metallization lines are in production around the world. The well documented savings due to lower water usage, less waste generation, a smaller equipment footprint, and lower power consumption are why these systems became popular. In addition to this, these systems do not require precious metals such as palladium to activate printed circuit structures for electroplating, offering significant operations savings. The latest generation of mobile technology utilizing fine line width and spacing has been enabled by the use 3-micron copper foils as a starting point. This thin foil technology requires exacting precision in controlling the copper etch budget during the formation of copper interconnects. Direct metallization processes like the latest generation Blackhole are in mass production today on ultra-thin copper foils for modified Semi-Additive Processing. Direct Metallization technology has evolved to this point though new breakthroughs in equipment and process technology that allow the formation of extremely fine lines and spaces being implemented in HDI designs today.

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Horizontal Electroless Copper

MacDermid Enthone M-Copper EF is the only electroless copper system on the market that is sold by an international plating supplier which can outperform local suppliers at a competitive price. M-Copper EF is specifically formulated from decades of experience with electroless copper plating and modern innovations to allow for a revolution in quality and service in a segment of the PCB industry that rarely sees new offerings. Your OEM customers will feel more confident knowing that their products were assembled with a process backed by a world-class organization. With M Copper EF you can rest assured that you are using only the best electroless copper metallization available. Don’t fall into the trap of compromising quality for cost, with M-Copper EF, you can have it all.

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Vertical Electroless Copper

Electroless copper has been the manufacturing standard for over 30 years, and MacDermid Enthone has been there since the beginning. Early innovations led to the development of the M-System/M-85, our highly successful heavy deposition electroless copper process. For the past 20 years, this process has become the industry standard for void free coverage. Maintaining the patented pretreatment system, MacDermid Enthone has developed the M-Copper Omega process, which takes copper to copper adhesion to a new level.

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Shadow

The Shadow advanced direct metallization process is a patented graphite based slightly alkaline aqueous dispersion of conductive colloids and proprietary additives used to make through-holes, and other vias, conductive for subsequent copper electroplating.

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Semi-Additive Process

Systek SAP is a family of high performance build-up processes for IC substrate RDL that provide multiple process flows for different materials as well as revolutionary technology innovations in pre-treatment, conditioning, activation and plating steps. The SAP process provides the optimal metallization seed layer for unclad build-up substrates. Process flows for fine-line, ultra fine-line, and flex materials are available for new design possibilities in IC substrate manufacturing of high density circuitry.

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IN THE NEWS

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MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan Sep 3, 2020, 9:42 AM

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Product Release: MacuSpec THF 100 Mar 31, 2020, 1:45 PM

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MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference Feb 14, 2020, 4:13 PM

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