Lead Frame Packaging Solutions

Our integrating lead frame packaging portfolio incorporates connected solutions which span the entire process of building QFN packages from lead frame roughening, to enhancing side wall solderability, and nearly everything in between.

With automotive electronics expanding at a rapid rate, lead frame packages like QFNs, QFSs, and DIPs will be deployed in new environments that demand the highest reliability. We offer a range of innovative products that can enhance reliability of these metal substrate packages.

Solderable Finish for QFN Sidewalls

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PackagePrep CE Tin S

Enable AOI and Enhance Solderability While Reducing Process Steps

Exposed copper at the singulated edge of QFN packages often solders poorly, preventing conventional solder fillets from forming. The lack of a visible solder fillet inhibits recognition by automated optical inspection (AOI). This reduced solder footprint of the package creates a reliability risk, limiting end-use applications.

PackagePrep CE Tin S solves these problems. The highly solderable immersion tin deposited by PackagePrep on the QFN package sidewall allows solder to wick up during paste reflow, creating perfectly formed solder fillets. These fillets can supplement or replace x-ray inspection because they are easily inspectable by AOI.

Reliability Focused Manufacturers Planning to Use QFNs Can Use PackagePrep CE Tin S to Achieve Their Goals.

Components that operate in harsh environments, such as automotive and aerospace assemblies, must meet more stringent demands than other components. The AOI inspection of the soldered, tin plated copper flanks allowed by PackagePrep enables a low cost, high reliability solution to the stringent requirements placed upon QFN packages in automotive applications.

Adhesion Promotion for Lead Frames

PackageBond is the no risk adhesion promotion system specifically engineered for reliability at today’s intense lead-free circuit assembly temperatures. Production proven in high-volume at premier semiconductor manufacturing facilities, our advanced laboratory innovations deliver extreme heat tolerance to lead frame packages.

PackageBond features patented chemistries that prevent delamination failure of molded packages due to moisture/reflow sensitivity. The process roughens copper alloy lead frames to maximize resin and encapsulant adhesion, plus deposits a thin adhesion booster for long-term delamination protection. PackageBond does not degrade Ag or Ni/Pd/Au plated lead frames, leaving these surfaces clean for predictably strong wire bonds. Production results confirm consistent compatibility with die attach adhesives and no adverse effects on resin bleed.

PackageBond is the advanced lead frame adhesion technology that is designed to overcome delamination problems to achieve MSL-1 reliability.

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Plating on Package / Antenna on Package

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PackagePlate

Metallization Processes for Plating on Package

The PackagePlate processes are a series of plating processes and technologies for metallizing specially activated LDS-grade epoxy mold compound that is molded onto semiconductor packages. The Plating on Package process is based on molded interconnect technology and allows for integration of circuitry inside and on top of chip package housings. PackagePlate processes have options available for fine pitch circuitry, blind and through hole vias, antennas, and selective shielding designs. 

 

 

High Brightness Spot Silver Plating for Lead Frame LEDs

HELIOFAB AG 7921

For the electroplating finishing of spot plated LED leadframes, the HELIOFAB AG 7921 process is the OEM approved process that plates a high brightness functional silver finish.

HELIOFAB AG 7921 consistently deposits highly reflective silver with measured GAM values around 2.0 over a wide current density window of 10 to 70 ASD. The ability to spot plate with high performance enables cost savings versus wasteful rack plating processes. The deposit does not degrade under luminous decay performance testing, and provides excellent die attach solderability and gold wire bondability.

 

 

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Lead Frame Packaging Portfolio

We offer a complete line of products for solutions in lead frame packaging. See our entire portfolio here: Click Here

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