Nickel Plating

LECTRO-NIC Sulfamate Nickel processes are engineered for high-speed, reel-to-reel applications. The processes are specially formulated for connectors, leadframes and a variety of semiconductor devices. LECTRO-NIC OXR-1300 is specially formulated to prevent discoloration of plated STANNOSTAR pure tin deposits during reflow and high temperature thermal bake conditions. LECTRO-NIC 10-03 HSX is a sulfamate type nickel electroplating formulation specifically designed for high speed plating in reel-to-reel equipment using soluble anodes.

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Tin and Tin-Lead Plating

Our pure tin and tin-lead processes are engineered for both rack and barrel plating systems. The whisker-resistant, extremely versatile processes provide very bright, consistent deposits over a wide current density range.

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IN THE NEWS

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MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan Sep 3, 2020, 9:42 AM

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Product Release: MacuSpec THF 100 Mar 31, 2020, 1:45 PM

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MacDermid Alpha to Exhibit and Present at the Upcoming IMAPS Device Packaging Conference Feb 14, 2020, 4:13 PM

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